HiSilicon déclare lors du salon de MWC de Barcelone en février 2012 utiliser une société des États-Unis pour l'ingénierie du chip graphique (il devrait s'agir de Vivante puisque les contrats de licence n'ont été signés qu'en mai avec IR et ARM). Consultez la liste des tâches à accomplir en page de discussion. With her headquarter in Shenzhen of China, Hisilicon has set up design divisions in Beijing, Shanghai, Silicon Valley (USA) and Sweden. It features: The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023. The Kirin 910 powered the company’s Huawei P6 S, MediaPad, and Ascend P7. Cette puce, qui est gravée en 10 nm, comprend quatre cœurs ARM Cortex-A73 fonctionnant jusqu'à 2,36 GHz ainsi que quatre cœurs ARM Cortex-A53 fonctionnant jusqu'à 1,8 GHz. 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1MB L3/core Shared. HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, http://www.kl-security.com/technology/technical_topic/hisilicon/ Hisilicon.

Elle s'est lancée la même année dans le développement de technologies de processeurs RISC, sous licence de la firme britannique ARM[1]. This is a revised version of K3V2 SoC with improved support of Intel baseband. Le 30 octobre 2012, ARM annonce qu'HiSilicon a signé des accords de licence sur sa nouvelle génération de processeurs 64 bits, la série nommée ARM Cortex-A50 [2]. HiSilicon is reputed to be the largest domestic designer of integrated circuits in China. LTE FDD mode : 150 Mbit/s downlink and 50 Mbit/s uplink. China-based manufacturing for flagship chips isn’t viable in the medium-term and the range of other potential partners is shrinking fast. Although Qualcomm’s Snapdragon still powers the majority of smartphone manufacturers, Huawei’s rise to the top three has produced a major rival. Company profile page for HiSilicon Technologies Co Ltd including stock price, company news, press releases, executives, board members, and contact information Elle s'est lancé la même année dans le développement de technologies de processeurs RISC, sous licence de la firme britannique ARM1. Doing so gives the company more control over how hardware and software interact with each other, resulting in products that punch above their weight, specification wise. In 2011, Richard Yu, current Huawei CEO, decided that HiSilicon should build in-house SoCs to differentiate its smartphones.

But Chinese regulatory approval is still a wild card. The most common Fitbit problems and how to fix them, More good news for Huawei as it regains access to crucial camera sensors, Report: Xiaomi beats Apple to become world’s third biggest smartphone firm, Good news for Huawei’s smartphone business as US reportedly allows chip sales, Huawei can allegedly buy Samsung display panels now (but not chipsets). What is an SoC? This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU. Il s'agit d'un SoC octo-core utilisant une architecture de type big.LITTLE, composé de 4 cœurs Cortex-A7 et 4 cœurs Cortex-A15.

Stocks are down on U. HiSilicon is one of China's largest integrated circuit design firms. Le Kirin 920 est présenté en mars 2014.

There’s a decent chance you’re reading this on one of its phones, seeing as the company is the world’s largest phone manufacturer at the time of writing. Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology. NXP Semiconductors reported a narrower-than-expected third-quarter loss on flat revenue. Working closely with the industry-leading technology companies and research institutions to release multiple advance process node, including the most advanced technology nodes like N16/N10/N7.

This leaves Huawei with the prospect of securing alternative chips from a rival, such as MediaTek. Huawei established its handset division in 2003, and shipped its first phone, the C300, in 2004. Huawei reports the core supports almost all the ARMv8.4-A ISA features with a few exceptions, including dot product and the FP16 FML extension. Le k3V2 est épaulé par le balong 710 spécialisé dans les communications réseaux[12]. La carte est compatible avec les distributions Linux, Ubuntu, Debian, OpenSUSE et Fedora[18].

The companies should have opportunities to pair AMD's CPUs and/or GPUs with Xilinx's FPGAs in many end-markets. These chips target lower-end CPU and GPU performance points, but the Kirin 820 has 5G sub-6GHz support to keep up with its rivals. © 1996-2018 TheStreet Inc. All rights reserved, Microsoft [29] Its specs: The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. Still, it’s a powerful chip found in both high-end Huawei and more cost-effective Honor branded models. Stock Sale DCC-910 42x42mm 1-Board 1/2. TD-LTE mode: up to 112 Mbit/s downlink and up to 30 Mbit/s uplink. Being a technology leader, HiSilicon paves the way for innovations in the global networking and ultra-HD video technologies from end-to-end.

Le K3V2 (Hi3620) est un SoC fondu par TSMC, sorti en 2012, comprenant notamment 4 cœurs ARM Cortex A9, 16 cœurs GPU, un bus de 64 bits, et contient un mécanisme nommé A.I.PS (pour Artificial Intelligence Power Scaling, signifiant en anglais ; échelonnage de puissance par intelligence artificielle), capable de gérer le nombre de cœurs fonctionnant et l'état des CPU et GPU automatiquement et de façon matérielle, alors que cela était fait jusqu'à présent à l'aide du noyau du système[7]. Au niveau vidéo, il peut encoder et décoder du HEVC et H.264 en 2160p30 ainsi que du HEVC en 2160p60[17]. For example, HiSilicon has released world first A17 plus A7 big. The Kirin A1 was announced on September 6, 2019. Action Alerts PLUS is a registered trademark of TheStreet, Inc. [27] Its specs: The Balong 5000 supports 2G, 3G, 4G, and 5G. Huawei used to be a major purchaser of Qualcomm’s Snapdragon processors and continued to use its chips in some of its more cost-effective Honor smartphones in recent years.

TMSC qui fondra l'ensemble du processeur est au moment du salon en technologie CMOS de 40 nm mais devrait être en largeur de grille de 28 nm dans le courant 2012[11]. Although that looks set to change in 2021 and beyond, which we’ll get into a little later. It’s found in a few high-end smartphones, including the Huawei P40 series and the Honor 30 Pro Plus. Dual-carrier aggregation for the 40 MHz bandwidth, LTE Cat.12 and Cat.13 UL network standards, 4x4 multiple-input multiple-output (MIMO), LTE Cat.19 Peak data rate up to 1.6 Gbit/s, Sub-6 GHz:Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s, mmWave:Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s, Isochronous Dual Channel transmission technology, 48 KB L1-I, 32 KB L1-D, 1MB L2/4 cores and 16MB CCN L3, 48 KB L1-I, 32 KB L1-D, 1MB L2/4 cores and 32MB CCN L3. DuPont tallies stronger-than-expected third-quarter adjusted earnings amid buoyant demand for electronics and imaging products. The Kirin processors compete with products from several other companies, including: Chinese fabless semiconductor manufacturing company, fully owned by Huawei, Companies with an annual revenue of over US$3 billion, Kirin 990 4G, Kirin 990 5G & Kirin 990E 5G, "HiSilicon Technologies Co., Ltd.: Private Company Information", HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, "HiSilicon Technologies Co., Ltd. 海思半导体有限公司", ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors, "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15", "Hisilicon grown into the largest local IC design companies", "U.S. strikes at a Huawei prize: chip juggernaut HiSilicon", "Huawei to stop making flagship chipsets as U.S. pressure bites, Chinese media say", brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked, Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate, "HiSilicon Kirin 650 SoC – Benchmarks and Specs", "Is the Kirin 710F in the Honor 9X any different from the Kirin 710? Can Huawei survive without its custom Kirin chips. they are capable of providing the best performance with lowest power and cost processor solution. Hisilicon has kept excellent strategic cooperation with partners from USA, Japan, Europe and China, thus maintain a complete and stable network covering wafer production, encapsulation and test. Hisilicon produit également des microprocesseurs utilisés dans des caméras IP. In that sense, HiSilicon has become an indispensable part of Huawei’s mobile success. TSC_INDUSTRY = '"Commercial and Service Industry Machinery Manufacturing" "Industrial Machinery Manufacturing"'; Your browser is not supported. [27] Its specs: The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network. Without Kirin, it’s unlikely Huawei’s smartphones will remain the competitive force they have been for several years. Il est gravé en 130 nm et équipé d'un ARM926EJ-S. Un article de Wikipédia, l'encyclopédie libre. [39] The Kunpeng 920 is utilized in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server and TaiShan XA320 V2 High-Density Server Node. HiSilicon Technology Co., Ltd (chinois simplifié : 海思半导体有限公司, pinyin : Hǎisī bàndǎotǐ yǒuxiàn gōngsī), est une entreprise de semi-conducteurs chinoise de Shenzhen, filiale de l'entreprise de produits de télécommunication Huawei, fondée en 2004 à partir de l'ancienne division de production d'ASIC de la société, créée en 1991. HiSilicon’s latest flagship SoC is the 5G-ready Kirin 990. The two business arms are inexorably interlinked, and it looks like a rough road ahead. Il était initialement destiné à être utilisé dans l'Ascend D2 et la phablette 6,1 pouces Ascend Mate de Huawei, mais c'est finalement le K3V2 qui a été utilisé dans ces deux appareils. HiSilicon Technologies Co., Ltd. was established in October 2004. Huawei is also partial to using MediaTek-made SoCs in some cheaper phones too, more so in light of the trade ban. Lithium-ion vs lithium-polymer: What’s the difference? HiSilicon Announces K3V2 Quad-core Application Processor, ARM signs HiSilicon to use Mali GPU cores, Vivante claims top GPU spot in China TD phones, Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate, HiSilicon Unveils Quad-Core Cortex A9 K3V2 Processor (Hi3620), HiSilicon Releases Leading LTE Multi-mode Chipset, brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked, Huawei introduces quad-core 10 inch tablet with 1080p display, Huawei is working on HiSilicon Quad Core K3V3 with Mali T658 GPU, Portail de l'électricité et de l'électronique, https://fr.wikipedia.org/w/index.php?title=HiSilicon&oldid=172453897, Entreprise de microélectronique ayant son siège en Chine, Article contenant un appel à traduction en anglais, Portail:Électricité et électronique/Articles liés, Portail:République populaire de Chine/Articles liés, licence Creative Commons attribution, partage dans les mêmes conditions, comment citer les auteurs et mentionner la licence, Foscam : FI9820W, FI9802W, FI8608W, FI8601W FI8602W, FI8620, FI8609W, FI8919WZ, Wansview : NCH-536MW, NCH536MW, NCH-532MW, NCH532MW, NCH-531MW, NCH531MW. Being a technology leader, HiSilicon paves the way for … The Ascend 910 and Ascend Cluster will be available in Q2 2019.[46]. Huawei doesn’t sell HiSilicon smartphone chips to third parties. COPYRIGHT © 2020 JOTRIN.COM ALL RIGHTS RESERVED, Full Name : Hisilicon Technologies Co, Ltd Manufacturer.

For mid-range and more affordable phones, Huawei has its own Kirin 800 range. [4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core. Le GPU est quant à lui un Mali-T658[15]. As the screw tightened, key chip manufacturing companies, such as TSMC, were banned from producing HiSilicon chips for Huawei. Huawei and Qualcomm are in closer competition than ever as they race for 5G and IoT related patents. Hon Hai Precision Industry (HNHAF) Stock Quotes - Nasdaq offers stock quotes & market activity data for US and global markets. It started shortly after HiSilicon announced its first mobile processors. The company’s concerns perhaps weren’t unfounded, as Huawei employees noted that working on the Nexus 6P with Google taught them a lot about hardware and software optimization.

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